发明名称 Cooling apparatus for an electrical substrate
摘要 A cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.
申请公布号 EP2728987(A2) 申请公布日期 2014.05.07
申请号 EP20130188821 申请日期 2013.10.16
申请人 DEERE & COMPANY 发明人 SCHMIT, CHRISTOPHER J;HARMELINK, GREGORY K
分类号 H05K7/20;H01L23/473 主分类号 H05K7/20
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