发明名称 |
Integrated circuit system with distributed power supply comprising interposer and voltage regulator module |
摘要 |
An integrated circuit system having an interposer and an integrated circuit with first and second bond pads, the integrated circuit die bonded to the interposer using the first bond pads. The integrated circuit having circuit blocks, that operate at different operating voltages and voltage regulator modules die bonded to the second bond pads of the integrated circuit. The voltage regulator modules converting a power supply voltage to the operating voltage of a respective circuit block and supply the respective operating voltage to the circuit block via the second bond pads. |
申请公布号 |
US8716855(B2) |
申请公布日期 |
2014.05.06 |
申请号 |
US20100943395 |
申请日期 |
2010.11.10 |
申请人 |
CHI SHYH-AN;PENG MARK SHANE;LEE YUN-HAN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHI SHYH-AN;PENG MARK SHANE;LEE YUN-HAN |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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