| 摘要 |
Enclosures for electronic components and methods for manufacturing the same are shown. In one embodiment, the enclosure includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall defining an interior space of the enclosure. A first mounting channel and a second mounting channel can be coupled to each one of the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall. A side channel can be removably coupled to the first mounting channel and the second mounting channel. A mounting panel can be removably coupled to the side channel, the mounting panel providing a flat surface extending away from the side channel towards a sidewall opposite a sidewall nearest the side channel and adapted to support electronic components. |
