| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a power conversion device having excellent cooling performance and capable of being easily downsized.SOLUTION: A power conversion device 1 comprises: a plurality of semiconductor modules 10 configuring a part of a power conversion circuit; a cooler 2 including a plurality of coolant passages which cool the plurality of semiconductor modules 10; and a frame 3 holding the semiconductor modules 10 and the cooler. The plurality of semiconductor modules 10 and the plurality of coolant passages are laminated with each other to configure a laminate 11. The cooler 2 includes a pair of coolant introduction/exhaust pipes 20 which introduce and exhaust a cooling medium formed extending to the outside of the frame 3 in a lamination direction with the coolant passage arranged in an end in the lamination direction as a base end. An outer diameter of a base end side pipe part 200 of at least one coolant introduction/exhaust pipe 20 of the pair of coolant introduction/exhaust pipes 20 is smaller than an outer diameter of a tip side pipe part 201 of the other coolant introduction/exhaust pipe 20. The base end side pipe part 200 is arranged inside the frame 3. The tip side pipe part 201 is arranged outside the frame 3.</p> |
