| 摘要 |
<p>Provided are a plasma treatment device and method by which plasma surface treatment is performed uniformly on an object to be treated. A substrate (11) is held by a holder (33) and housed inside a treatment chamber. Electrode sets (31, 32) are arranged opposite the surfaces of the substrate (11) and the electrode sets (31, 32) are configured from first electrode units (31a, 32a) and second electrode units (31b, 32b) comprising high-frequency electrodes (25) and ground electrodes (26) arranged in rows. A process gas emitted from an inlet is passed between the electrodes (25, 26) to generate plasma, and the generated plasma removes contaminants on the surface of the substrate (11).</p> |
