发明名称 SUBSTRATE INSPECTION DEVICE AND CORRECTION INFORMATION ACQUISITION METHOD
摘要 PROBLEM TO BE SOLVED: To acquire accurate correction information without increasing manufacturing costs.SOLUTION: After trace formation processing for forming traces M on a trace sheet by probing with probes, first imaging processing for imaging a range A1 defined so as to include traces M formed by a reference probe and probes around the reference probe, imaging range designation request processing for displaying an image in the range A1 and designating a range A2 which includes the trace M formed by the reference probe and is narrower than the range A1, and second imaging processing for imaging the designated range A2 are executed in this order. Then, trace position specifying processing for analyzing image data in the range A2 to specify a position of the trace M formed by the reference probe and displacement state specifying processing for specifying the amount and direction of displacement of the specified position of the trace M from a reference probing position are executed to acquire the amount and the direction of displacement as correction information.
申请公布号 JP2014077728(A) 申请公布日期 2014.05.01
申请号 JP20120226128 申请日期 2012.10.11
申请人 HIOKI EE CORP 发明人 NISHIZAWA MINORU;TANAKA YUJI;ANDO KOICHI;OGAWARA TAKESHI
分类号 G01R31/02;G01R31/28 主分类号 G01R31/02
代理机构 代理人
主权项
地址