发明名称 ULTRASONIC MEASUREMENT DEVICE, HEAD UNIT, PROBE, AND DIAGNOSTIC DEVICE
摘要 An ultrasonic measurement device includes a substrate, an ultrasonic transducer device, and an integrated circuit device. The ultrasonic transducer device has an ultrasonic element array arranged on the substrate. The integrated circuit device is mounted on the substrate. The ultrasonic element array is rectangle, and when a long side direction of the rectangle is defined as a first direction, the integrated circuit device is mounted on the substrate so as to form the long side direction of the integrated circuit device along the first direction. The integrated circuit device is arranged along the first direction and has a plurality of transmission circuits that output transmission signals to the ultrasonic element array.
申请公布号 US2014116140(A1) 申请公布日期 2014.05.01
申请号 US201314062190 申请日期 2013.10.24
申请人 SEIKO EPSON CORPORATION 发明人 ENDO KOGO
分类号 G01N29/22;G01N29/24 主分类号 G01N29/22
代理机构 代理人
主权项
地址