SUBSTRATE BONDING APPARATUS, ALIGNING APPARATUS, SUBSTRATE BONDING METHOD, ALIGNING METHOD, AND LAMINATED SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

There has been a problem of generating a positional shift between substrates due to factors after alignment, even if the substrates are accurately aligned with each other. This substrate bonding apparatus that bonds a first substrate and a second substrate to each other is provided with: an aligning unit that aligns the first substrate and the second substrate to each other by means of an aligning apparatus; a transfer unit that carries out the first substrate and the second substrate from the aligning unit, said first substrate and the second substrate having been aligned with each other; a bonding unit that bonds the first substrate and the second substrate to each other, said first substrate and the second substrate having been transferred by means of the transfer unit; and a determining unit that determines, after the substrates are aligned with each other by means of the aligning unit and prior to carrying out the substrates by means of the transfer unit, whether there is a positional shift between the first substrate and the second substrate.