| 摘要 |
A solid-state imaging apparatus comprising a semiconductor layer, a first region on a side of a first surface of the semiconductor layer, and a second region on a side of a second surface of the semiconductor layer, wherein photoelectric conversion portions are arrayed in the semiconductor layer, lens portions are arrayed in the first region, and an interconnection pattern and reflection portions are arrayed in the second region, in one of pixels of the apparatus, the apparatus has a structure in which sectional areas, on the second surface and on a reflection surface of the reflection portion, of the light beam traveling from the photoelectric conversion portion, are larger than a sectional area, in a portion between the photoelectric conversion portion and the reflection portion, of the light beam traveling from the photoelectric conversion portion. |
