发明名称 ADHESIVE FOR CORRUGATED BOARD
摘要 <p>An adhesive for corrugated board containing starch glue and an alkali contains a buffering-action-exhibiting agent (excluding boron compounds) and a water-resistant additive. The buffering-action-exhibiting agent is selected from an inorganic acid, an organic acid (alkali salt), etc. that exhibit a pH buffering effect on being added. The water-resistant additive is a chemical that provides water resistance to the starch powder upon polymerizing. This adhesive for corrugated board has adhesive performance at least as good as a conventional boron-compound-containing starch-based adhesive, even if a boron compound is not used.</p>
申请公布号 WO2014065265(A1) 申请公布日期 2014.05.01
申请号 WO2013JP78544 申请日期 2013.10.22
申请人 JAPAN CORN STARCH CO., LTD 发明人 KAWAMATSU, TETSUYA
分类号 C09J103/00;C09J11/00;C09J103/04 主分类号 C09J103/00
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