| 摘要 |
<p>A chip on film according to an exemplary embodiment includes: a driving film (10), a wire layer (20) formed on a first surface of the driving film (10), a driving chip (30) connected to the wire layer (20), and an electromagnetic wave blocking layer (50) formed on a second surface of the driving film (10), in which a mesh portion (51) may be formed on a portion of the electromagnetic wave blocking layer (50).</p> |
