| 摘要 |
Top face of circuit board 30 is provided with electrode pads 313a to 313j for mounting a multi-pin connector 10; its back face is provided with microstrip lines 334a to 334j for electrically connecting the multi-pin connector 10 with coaxial connectors 20a to 20j. Circuit board 30 has a ground pattern 333 serving as a counter-electrode of microstrip lines 334a to 334j. The routing directions ²1 of adjacent microstrip lines 334d and 334e, 334f and 334g, 334h and 334i are opposite each other. Through-hole electrodes 34a to 34j for establishing electrical connection between electrode pads 313a to 313j and microstrip lines 334a to 334j are disposed within a component mounting area ³, i.e., below the multi-pin connector 10. The invention aims to reduce crosstalk in an evaluation board for measurement of high frequency characteristics of transmission paths including a multi-pin connector and reduce the influence of impedance of the multi-pin connector on the evaluation board. |
