发明名称 Method for producing matt copper deposits
摘要 <p>The present invention relates to a method for deposition of a matt copper coating wherein a first copper layer is deposited from an aqueous copper electrolyte which does not contain an organic compound comprising divalent sulfur. A second copper layer is then deposited onto the first copper layer from an aqueous copper electrolyte comprising a first and a second water soluble sulfur-containing additive wherein the first water soluble sulfur-containing compound is an alkyl sulfonic acid derivative and the second water soluble sulfur-containing additive is an aromatic sulfonic acid derivative. The method provides copper layers with a homogeneous and adjustable matt appearance for decorative applications.</p>
申请公布号 EP2620529(B1) 申请公布日期 2014.04.30
申请号 EP20120152390 申请日期 2012.01.25
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 KRETSCHMER, STEFAN;HARTMANN, DR. PHILIP;ROELFS, DR. BERND
分类号 C25D3/38;C25D5/10 主分类号 C25D3/38
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