发明名称 |
Method for producing matt copper deposits |
摘要 |
<p>The present invention relates to a method for deposition of a matt copper coating wherein a first copper layer is deposited from an aqueous copper electrolyte which does not contain an organic compound comprising divalent sulfur. A second copper layer is then deposited onto the first copper layer from an aqueous copper electrolyte comprising a first and a second water soluble sulfur-containing additive wherein the first water soluble sulfur-containing compound is an alkyl sulfonic acid derivative and the second water soluble sulfur-containing additive is an aromatic sulfonic acid derivative. The method provides copper layers with a homogeneous and adjustable matt appearance for decorative applications.</p> |
申请公布号 |
EP2620529(B1) |
申请公布日期 |
2014.04.30 |
申请号 |
EP20120152390 |
申请日期 |
2012.01.25 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
KRETSCHMER, STEFAN;HARTMANN, DR. PHILIP;ROELFS, DR. BERND |
分类号 |
C25D3/38;C25D5/10 |
主分类号 |
C25D3/38 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|