CONDUCTIVE PASTE PRINTED CIRCUIT BOARD HAVING PLATING LAYER AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a printed circuit board including an electroless metal plating layer or an electrolytic metal plating layer which is additionally formed on the electroless metal plating layer to improve the electric conductivity of a substrate, a wiring layer which is patterned on the substrate by a printing method of a conductive paste composition, the electroless metal plating layer which is formed on the patterned wiring layer, and a wire which is composed of the patterned wiring layer and the electroless metal plating layer, and a manufacturing method thereof.