Apparatus and method for manufacturing an integrated circuit

摘要

An apparatus for manufacturing an integrated circuit having a thick film metal layer includes an applicator for applying a layer of metal paste onto a heat-conducting substrate. The metal paste includes metal particles of a predetermined size. An RF generator selectively inductively couples RF energy into the metal paste. The predetermined size of the metal particles of the metal paste corresponds to a coupling frequency of the RF energy for heating the metal particles. In this way, the metal particles of the metal paste are heated with only a small fraction of the power of conventional processes, and without the need to pre-sinter the metal paste.