发明名称 Method for fabricating a lead-frameless power inductor
摘要 A lead-frameless power inductor and its fabrication method are disclosed. The power inductor comprises a lower substrate, a coil provided on the lower substrate, and an intermediate layer which encloses the coil, wherein the lower substrate can be a soft magnetic entrainer or a non-magnetic entrainer. The coil is made of an insulated wire, and the intermediate layer is a colloid consisting of magnetic powder. A method for fabricating the lead-frameless power inductor includes steps of preparing a lower substrate; forming a plurality of conducting metal layers on the lower substrate; forming a wire package on an upper surface of said lower substrate; coating a surface of said wire package with a magnetic powder; dividing the substrate into a plurality of granulated elements by cutting process; and forming the conducting metal layer on both sides of the element to form a surface mounting device.
申请公布号 US8707547(B2) 申请公布日期 2014.04.29
申请号 US201213547434 申请日期 2012.07.12
申请人 LEE WEI CHIH;INPAQ TECHNOLOGY CO., LTD. 发明人 LEE WEI CHIH
分类号 H01F3/00;H01F41/02 主分类号 H01F3/00
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