POLISHING SLURRY COMPOSITION AND SUBSTRATE OR WAFER POLISHING METHOD USING THE SAME

摘要

The present invention relates to a polishing slurry composition having a selection ratio of a nitride film and a method for polishing a wafer or a substrate using the same. The polishing slurry composition of the present invention achieves a higher polishing selection ratio of a nitride film compared to an oxide film and manufactures a polishing particle by a liquid phase method to reduce an occurrence of a micro-stretch on the surface of a substrate or a wafer. In addition, a high dispersion stability is maintained to prevent an aggregation of the polishing particle to reduce the occurrence of the micro-stretch.