| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding apparatus and a grinding method which can reduce a risk of missing the outer periphery of a chip when dividing a workpiece, having division start points formed therein, into a plurality of chips by grinding.SOLUTION: Back surface 1b of a wafer 1 is ground roughly to a thickness not reaching a finish thickness (grinding step), and after releasing suction holding of the wafer 1 to a holding table 20 (suction release step), an expand tape 4 is expanded and the wafer 1 is divided into chips 9 along division schedule lines 3 in which division start points are formed, while forming an interval 9a between the chips (interval formation step). Thereafter, the wafer 1 divided into chips 9 is suction held to the holding table 20 again (re-holding step), and ground to the finish thickness (finish grinding step). Since a divided chip 9 is suction held and subjected to finish grinding, contact of adjoining chips 9 is prevented, and the outer periphery is not chipped. |
