发明名称 LASER PROCESSING METHOD AND LASER LIGHT IRRADIATION DEVICE
摘要 A laser treatment method uses a laser treatment device provided with: a laser light source that outputs laser light which includes a plurality of wavelength components; a collimating lens that receives the laser light irradiated by the laser light source; and a light collecting lens (40) that receives the laser light collimated by the collimating lens. The method is provided with a step for preparing material to be treated and a step for irradiating the material to be treated with laser light collected by the light collecting lens (40) in the laser treatment device. In the step for irradiation with the laser light, the positions of the collimating lens and light collecting lens (40) are adjusted and the wave surface shape of the laser light received by the light collecting lens (40) is adjusted to adjust the size of the collected light region formed by a plurality of focal points corresponding to the plurality of wavelength components of the laser light collected by the light collecting lens (40).
申请公布号 WO2014061438(A1) 申请公布日期 2014.04.24
申请号 WO2013JP76636 申请日期 2013.10.01
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 NAGANO, SHIGEHIRO;KAKUI, MOTOKI;OKAMOTO, YASUHIRO;OKADA, AKIRA
分类号 B23K26/06;B23K26/04 主分类号 B23K26/06
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