发明名称 |
METHOD OF MANUFACTURING CIRCUIT BOARD AND CHIP PACKAGE AND CIRCUIT BOARD MANUFACTURED BY USING THE METHOD |
摘要 |
Provided is a method of manufacturing a circuit board. The method includes: preparing a base substrate including a core layer and a first conductive layer that is formed on at least one surface of the core layer and includes an internal circuit pattern; forming a build-up material to cover the first conductive layer; forming in the build-up material at least one cavity through which the core layer and the first conductive layer are exposed; forming a laminated body by curing the build-up material in which the at least one cavity is formed; and forming a second conductive layer including an external circuit pattern on an outer surface of the laminated body. |
申请公布号 |
US2014113415(A1) |
申请公布日期 |
2014.04.24 |
申请号 |
US201313924705 |
申请日期 |
2013.06.24 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
LEE SANG-MIN |
分类号 |
H01L21/52;H05K1/18;H05K3/46 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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