发明名称 HIGH THERMAL CONDUCTIVE RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To produce a thermoplastic resin composition in which inorganic compounds and a fibrous reinforcing material are uniformly dispersed and which exhibits high thermal conductivity and has high fluidity and high strength.SOLUTION: In a method for producing a high thermal conductive resin composition comprising the following components (A) to (D), the component (D) is side-fed from the vicinity of a tip of a cylinder provided in an extruder, and a resin pressure at a die part is 50 kgf/cmor more. (A) a thermoplastic polyester resin, (B) a not tetrapod-shaped inorganic compound, (C) a tetrapod-shaped inorganic compound in an amount of 1-10 vol.% based on the whole amount of the high thermal conductive resin composition, and (D) a fibrous reinforcing material.
申请公布号 JP2014074083(A) 申请公布日期 2014.04.24
申请号 JP20120220569 申请日期 2012.10.02
申请人 KANEKA CORP 发明人 UCHIDA SOICHI;MATSUMOTO KAZUAKI;SAKAGUCHI MASAFUMI;NODA TAIJI;UBUKATA SHOJI
分类号 C08J3/20 主分类号 C08J3/20
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