| 发明名称 |
ETCHING MATERIAL |
| 摘要 |
An etching material which contains at least one boron compound that is selected from among Lewis acids that contain, in the structures thereof, a boron atom and a halogen atom that is bonded to the boron atom, salts of the Lewis acids, and compounds that generate the Lewis acids. |
| 申请公布号 |
WO2014061245(A1) |
申请公布日期 |
2014.04.24 |
| 申请号 |
WO2013JP06074 |
申请日期 |
2013.10.11 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
NAKAKO, HIDEO;KUMASHIRO, YASUSHI;NOUDOU, TAKAAKI;INADA, MAKI;KURODA, KYOKO |
| 分类号 |
H01L21/308;C09K13/10;H01L31/04 |
主分类号 |
H01L21/308 |
| 代理机构 |
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