| 摘要 |
Provided is a resin composition for protective film formation, a protective film, and a method for forming a pattern capable of forming a protective film having a uniform film thickness with no peeling or application imperfections on the substrate or the film formed on the substrate, whereby in pattern formation using a developing fluid containing an organic solvent, a very fine and uniform pattern can be formed. Also provided is a method for forming a pattern capable of forming a desired pattern on an organic semiconductor film using the formed resist and the protective film pattern as a mask, and subsequently capable of removing the resist and protective film pattern used as a mask without damaging the underlying organic semiconductor film. Also provided is an electronic device manufactured using a method for manufacturing an electronic device including the method for forming a pattern. A resin composition based on the developing fluid containing an organic solvent used in developing for pattern formation, the resin composition used to form a protective film for protecting a substrate or a film formed on the substrate, and the resin composition containing water and at least two resins having a hydroxy group, the resins having differing main chain structures. |
