| 摘要 |
A electronic device housing includes a substrate, and the electronic device housing further includes a first color layer, a metallic coating, a second color layer, and a second metallic coating formed directly on the substrate in that order. The first color layer is disposed on the substrate and covering portions of the internal surface. The first metallic coating is formed on the first color layer and completely covers the first color layer. The second color layer is formed on the first metallic coating and directly covers the portions of the internal surface which is uncovered by the first color layer. The second color layer and the first color layer have different colors. The second color layer and the first color layer are transparent or translucent. A method for manufacturing the electronic device housing is also provided. |
