| 摘要 |
PROBLEM TO BE SOLVED: To suppress upsizing of a device having a centering function for a workpiece, due to upsizing of the workpiece without spoiling the centering function. SOLUTION: A wafer grip part 20 is equipped with: a fixed grip pin 201; and a movable grip pin 202 for moving in a horizontal direction, and is provided with an opening part 200 that a wafer holding pad 34 passes through in a vertical direction, and the wafer grip part 20 and wafer holding pad 34 are enabled to relatively move in the horizontal direction. The movable grip pin 202 is then moved toward the fixed grip pin 201 to grip the wafer, which is transferred with a center position thereof aligned with a certain position and held by the wafer holding pad 34 lowered while the state is maintained. Then the grip state is canceled and the wafer is mounted on a chuck table. The device has both a transfer function and the centering function, so that a dedicated centering mechanism is not necessary for the processing device, which is made compact. COPYRIGHT: (C)2011,JPO&INPIT |
