发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A printed circuit board according to the present invention includes a base substrate with a contact pad on one side, and a stack bump on the contact pad. The stack bump is made of a first bump in contact with the contact pad, and a second bump on the first bump. The first bump can be made of a material with a lower hardness than that of the second bump. |
申请公布号 |
KR20140047935(A) |
申请公布日期 |
2014.04.23 |
申请号 |
KR20120114309 |
申请日期 |
2012.10.15 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, KI WON;YOON, KYOUNG RO |
分类号 |
H01L21/60;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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