发明名称
摘要 PROBLEM TO BE SOLVED: To provide a double sided substrate which can increase a degree of freedom for a layout while maintaining insulation quality and waterproofness. SOLUTION: A double sided substrate has a substrate body 2 which electronic components 100 and 104 are respectively placed on front and rear surfaces. A first electrode 6a electrically connected with the electronic component is provided on the front surface side of the substrate body 2, and a second electrode 6b electrically connected with the electronic component is provided on the rear surface side of the substrate body 2. The substrate body 2 is covered by a package 3 made of a resin mold as well as the electronic components. The first electrode 6a and the second electrode 6b respectively have contact surfaces which are exposed on a surface of the package 3 for being electrically connected with external terminals, and the contact surfaces are respectively recessed from the surface of the package 3. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5479306(B2) 申请公布日期 2014.04.23
申请号 JP20100257893 申请日期 2010.11.18
申请人 发明人
分类号 H05K3/28;B60R16/02 主分类号 H05K3/28
代理机构 代理人
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