GLASS SUBSTRATE CUTTING METHOD AND OPTICAL GLASS FOR SOLID-STATE IMAGE CAPTURING DEVICE

摘要

Provided is a cutting method for obtaining a glass substrate having mechanical strength and cleanliness. A glass substrate cutting method is provided with: a step of applying laser light with a light concentration point adjusted to the inside of a glass substrate provided with two light transmissive surfaces facing each other in a substrate thickness direction to form a flaw region serving as a cutting starting point inside the glass substrate in the thickness direction thereof along a scheduled cutting line of the glass substrate; and a step of generating a fracture occurring in the thickness direction of the glass substrate with the flaw region as a starting point to cut the glass substrate along the scheduled cutting line. The flaw region is apart from at least one of the light transmissive surfaces.