发明名称 SUBSTRATE LAMINATING DEVICE, SUBSTRATE LAMINATING METHOD, AND APPLICATION DEVICE
摘要 PROBLEM TO BE SOLVED: To suppress flow of an ultraviolet curable resin after application.SOLUTION: First, an ultraviolet curable resin is discharged from an application head and is applied on a plane of one of a display substrate and a cover substrate into a prescribed pattern. In parallel with this application of the ultraviolet curable resin, the whole or a part of at least long-side end parts of the ultraviolet curable resin applied to one substrate is irradiated with ultraviolet rays for temporarily curing the resin by an irradiation part arranged integrally with the application head. Then, the surface applied with the ultraviolet curable resin, of one substrate and one surface of the other substrate are laminated.
申请公布号 JP2014071313(A) 申请公布日期 2014.04.21
申请号 JP20120217748 申请日期 2012.09.28
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 MUNETO MASATOSHI;ARAKI MASAKI;SATO KAZUNARI;YAMAZAKI FUJIO
分类号 G09F9/00;B32B27/16;B32B37/00;G02F1/13;G02F1/1333 主分类号 G09F9/00
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