| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip component capable of downsizing by effectively utilizing a space in a substrate surface and increasing the number of chips per wafer.SOLUTION: A chip resistor 1 includes: a substrate 2; an element 5 containing a plurality of resistors R formed on the substrate 2; and a first connection electrode 3 and a second connection electrode 4 for connecting the element 5 externally. The substrate 2 is formed in a trapezoidal shape having internal angles of an acute angle &thetas;and an obtuse angle &thetas;in a plan view observed from a normal direction of an element forming surface 2A on which the element 5 is formed. |
