发明名称 VAPOR DEPOSITION DEVICE
摘要 PROBLEM TO BE SOLVED: To form a stable vapor deposition pattern on a substrate by keeping temperature of a mask during vapor deposition constant with a simple mechanism in a vapor deposition device.SOLUTION: In a vapor deposition device, a vapor deposition source is heated to evaporate an evaporation material, and a mask defining a vapor deposition pattern on a substrate is brought into contact with the substrate, so as to form a thin film on the substrate. The vapor deposition device has a heating plate contacting the mask, and a pipeline that passes inside the vapor deposition source and the heating plate, and in which a cooling medium flows. Then, the cooling medium is heated by heat of the vapor deposition source, so that the heated cooling medium flows in the heating plate. Also, the vapor deposition device is provided with heating means different from the vapor deposition source, and the pipeline may pass inside the heating means and the heating plate.
申请公布号 JP2014070239(A) 申请公布日期 2014.04.21
申请号 JP20120216329 申请日期 2012.09.28
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 FUKUSHIMA MAKOTO
分类号 C23C14/24;C23C14/04;H01L51/50;H05B33/10 主分类号 C23C14/24
代理机构 代理人
主权项
地址