| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire for cut suitable for an etching cut method reducing wide cutting loss by abrasive grains of a saw wire, and to provide a cutting method of an inorganic brittle material using the same.SOLUTION: There are provided a wire for etching cut 2 constituted of a small diameter metal wire (Co alloy thin line) made of a Co alloy including, by mass%, Ni:12.0 to 20.0%, Cr:12.0 to 25.0%, Co:35 to 60%, and having high strength property with a bearing force of 1,500 to 2,200 N/mm2 with a wire diameter of 0.2 mm or less, a pitting potential property based on JIS-G0577 (V'c10):0.60 to 0.75 V and an electric resistivity of 80 to 110 μ&OHgr; cm (in the room temperature environment) for chemically cutting an inorganic brittle material by corrosion etching, and a cutting method of the inorganic brittle material by the wire. |
