RADIATION-CURING ADHESIVE TAPE FOR DICING

摘要

PROBLEM TO BE SOLVED: To provide a radiation-curing adhesive tape for dicing, capable of easily picking up even a semiconductor chip or the like on which a through electrode is provided, without any residual adhesive in a pickup step.SOLUTION: A radiation-curing adhesive tape 1 for dicing of the present invention has a radiation-curing adhesive layer 3 provided on a base material sheet 2. In the radiation-curing adhesive tape 1, the ratio of a Young's modulus after radiation curing to a Young's modulus before radiation curing is 1.8 or less.