| 摘要 |
<p>Provided is a solvent composition capable of inhibiting a reduction in electrical characteristics, defects in wiring and coating film formation, and the occurrence of delamination, the solvent composition serving as a raw material of a paste composition for forming a coating film or wiring of an electronic device by coating on a coating surface member by printing. This solvent composition for manufacturing an electronic device is used for manufacturing an electronic device by printing, wherein the solvent composition comprises a solvent and a compound (excluding monohydroxy steric acid) expressed by the following formula (1) R1-CH2-R2 (1) (where R1 represents a monohydroxyalkyl group, and R2 represents a carboxyl group (C(=O)OH) or an amide group (C(=O)NH2).</p> |
