发明名称 |
SUBSTRATE PROCESSING METHOD, CONTACT ANGLE CONTROL DEVICE, AND RECORDING MEDIUM FOR PROCESSING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To stabilize a developing process and a rinsing process.SOLUTION: An application and development device 1 includes a storage part 101 for preliminarily storing contact angle information representing contact angles of an antireflection film and a resist film after a developing process. A substrate processing method includes: a comparing step of reading the contact angle information preliminarily stored in the storage part 101 and comparing a contact angle of the antireflection film with a contact angle of the resist film; a determining step of, when a difference is determined between the contact angle of the antireflection film and the contact angle of the resist film in the comparing step, determining to carry out one of an HMDS process and a UV process based on the difference between contact angles so as to obtain uniform distribution of a contact angle of the antireflection film and a contact angle of the resist film; and a process execution step of executing one of the HMDS process and the UV process according to the determination result in the determination step. |
申请公布号 |
JP2014067966(A) |
申请公布日期 |
2014.04.17 |
申请号 |
JP20120214043 |
申请日期 |
2012.09.27 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
KAI AKIKO;IZEKI TOSHIHIRO |
分类号 |
H01L21/027;G03F7/38 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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