发明名称 |
Semiconductor Device and Method of Forming Conductive Ink Layer as Interconnect Structure Between Semiconductor Packages |
摘要 |
A semiconductor device has a semiconductor die with an encapsulant deposited over and around the semiconductor die. An opening is formed in a first surface of the encapsulant by etching or LDA. A plurality of bumps is optionally formed over the semiconductor die. A bump is recessed within the opening of the encapsulant. A conductive ink is formed over the first surface of the encapsulant, bump and sidewall of the opening. The conductive ink can be applied by a printing process. An interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The interconnect structure is electrically connected to the semiconductor die. A semiconductor package is disposed over the first surface of the encapsulant with a plurality of bumps electrically connected to the conductive ink layer. The semiconductor package may contain a memory device. |
申请公布号 |
US2014103509(A1) |
申请公布日期 |
2014.04.17 |
申请号 |
US201213653242 |
申请日期 |
2012.10.16 |
申请人 |
STATS CHIPPAC, LTD. |
发明人 |
YOON INSANG;CARSON FLYNN;SHIM IL KWON;MUN SEONGHUN |
分类号 |
H01L23/495;H01L21/60;H01L21/98 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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