| 摘要 |
PROBLEM TO BE SOLVED: To reduce foot printing, the damage of a substrate, and the adhesion of particles.SOLUTION: A substrate processing system includes a carrier carrying in/out block 2; a processing block 4 made by laminating a first processing block 4a and a second processing block 4b; a substrate carrying in/out block 3 provided between the carrier carrying in/out block and the processing block; a substrate carrying portion 7a placing the carrier C at a position communicating to the first processing block; a substrate carrying out portion 7b placing the carrier at a position communicating to the second processing block; a first main arm A1 for carrying a wafer in the carrier placed at a carrier carrying portion to the first processing block; a second main arm A5 for carrying a wafer processed by the second processing block to the carrier on a carrier carrying out portion; and a carrier carrying device 8 carrying the carrier between the carrier carrying in/out block, the substrate carrying in portion, and the substrate carrying out portion, and carrying the carrier on the substrate carrying in portion to the substrate carrying out portion. |
