| 摘要 |
<p>Provided are a thermosetting resin having excellent heat resistance, a low coefficient of thermal expansion, and excellent moldability, and a thermosetting resin composition used for the resin. This thermosetting resin is characterized in being obtained by polymerizing a mixture containing a compound having a specific structure, another compound having a specific structure in a molar quantity 0.2-0.5 times that of the above-mentioned compound, and a cyanic acid ester.</p> |
