| 摘要 |
The invention, involving grinding and polishing flat processing and thinning processing of hard and brittle materials such as silicon wafer, sapphire substrate and the glass substrate, belongs to ultra-precision machining technical field and provides a multifunction substrate grinding and polishing device and method for the substrate grinding and polishing, which could be used in the grinding and polishing process of flat substrate such as ceramics, metal and composite materials. The grinding and polishing of substrate are processed in three ways: axial plunge grinding and polishing, radial plunge grinding and polishing and back grinding and polishing of wafer with outer rim. Double-spindle structure consisting of grinding spindle unit and polishing spindle unit is used in the substrate grinding and polishing device where both substrate grinding and polishing can be done. The grinding spindle unit and polishing spindle counterweigh mutually via a traction rope. Since Grinding machine and polishing machine are integrated in the substrate grinding and polishing device, the grinding process and polishing process could be finished in order with just one clamping of the substrate, which improves the precision of the substrate grinding and polishing and the automation of grinding and polishing process, reduces fragmentation and improves production efficiency. |
