发明名称 CHIP-LEVEL HUMIDITY PROTECTION
摘要 An electronic apparatus includes a semiconductor substrate, a device structure supported by the semiconductor substrate, and a guard ring surrounding the device structure. The guard ring includes a plurality of conductive structures spaced apart from one another, supported by the semiconductor substrate, and coupled to a voltage source to establish an operating voltage for the guard ring.
申请公布号 US2014103532(A1) 申请公布日期 2014.04.17
申请号 US201213650872 申请日期 2012.10.12
申请人 HUANG JENN HWA;SUAREZ JOSE L.;WEI YUN 发明人 HUANG JENN HWA;SUAREZ JOSE L.;WEI YUN
分类号 H01L23/58;H01L21/768;H01L23/488 主分类号 H01L23/58
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