发明名称 |
CHIP-LEVEL HUMIDITY PROTECTION |
摘要 |
An electronic apparatus includes a semiconductor substrate, a device structure supported by the semiconductor substrate, and a guard ring surrounding the device structure. The guard ring includes a plurality of conductive structures spaced apart from one another, supported by the semiconductor substrate, and coupled to a voltage source to establish an operating voltage for the guard ring. |
申请公布号 |
US2014103532(A1) |
申请公布日期 |
2014.04.17 |
申请号 |
US201213650872 |
申请日期 |
2012.10.12 |
申请人 |
HUANG JENN HWA;SUAREZ JOSE L.;WEI YUN |
发明人 |
HUANG JENN HWA;SUAREZ JOSE L.;WEI YUN |
分类号 |
H01L23/58;H01L21/768;H01L23/488 |
主分类号 |
H01L23/58 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|