发明名称 |
STACKED CHIP IMAGE SENSOR WITH LIGHT-SENSITIVE CIRCUIT ELEMENTS ON THE BOTTOM CHIP |
摘要 |
An example imaging sensor system includes a backside-illuminated CMOS imaging array formed in a first semiconductor layer of a first wafer. The CMOS imaging array includes an N number of pixels, where each pixel includes a photodiode region. The first wafer is bonded to a second wafer at a bonding interface between a first metal stack of the first wafer and a second metal stack of the second wafer. A storage device is disposed in a second semiconductor layer of the second wafer. The storage device includes at least N number of storage cells, where each of the N number of storage cells are configured to store a signal representative of image charge accumulated by a respective photodiode region. Each storage cell includes a circuit element that is sensitive to light-induced leakage. |
申请公布号 |
US2014103411(A1) |
申请公布日期 |
2014.04.17 |
申请号 |
US201314033293 |
申请日期 |
2013.09.20 |
申请人 |
OMNIVISION TECHNOLOGIES, INC. |
发明人 |
DAI TIEJUN;TSAU GUANNHO GEORGE |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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