| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being further downsized.SOLUTION: A semiconductor device includes: a wiring substrate 11 in which a plurality of bonding pads T1 to T3 are provided only on a surface S1; lead frames 21 to 29 mounted only on the surface S1 of the wiring substrate 11; switching elements 31 to 34 mounted on end surfaces S3 of the lead frames 21 and 22 in areas where the wiring substrate 11 and the lead frames 21 and 22 are overlapped; and a plurality of wires W1 to W13 and W having one ends connected to the bonding pads T1 to T3, and having the other ends connected to end surfaces S4 of the switching elements 31 to 34 at a side spaced apart from the end surfaces S3 or the other ends connected to the end surfaces S3 of the lead frames 23 to 29 in areas where the wiring substrate 11 and the lead frames 23 to 29 are overlapped. |
