发明名称 WOODEN FLOOR MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a wooden floor material for direct flooring, which is excellent in sound insulating property and rigidity, and which can suppress warping, dimensional variations and the like even by using a decorative material with a thickness of 1 mm or more.SOLUTION: In a wooden floor material, a woody decorative material 1 with a thickness of 1.0-3.0 mm, a veneer 2 with a thickness of 1.0-3.0 mm, the fiber direction of which is orthogonal to that of the woody decorative material 1, plywood 3 with a thickness of 5.0-12 mm, and a buffer material 4 with a thickness of 1.5-10 mm are stacked in order and joined together. The plywood 3 is divided into a plurality of pieces by a back groove 11 orthogonal to the longitudinal direction of the wooden floor material.
申请公布号 JP2014066126(A) 申请公布日期 2014.04.17
申请号 JP20130004639 申请日期 2013.01.15
申请人 ASAHI WOODTEC CORP 发明人 FUKUDA AKIKO;HAYASHI TSUGUTO
分类号 E04F15/04 主分类号 E04F15/04
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