| 发明名称 |
COPPER ELECTRODEPOSITION IN MICROELECTRONICS |
| 摘要 |
A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a quaternized pyridinium salt compound for leveling. |
| 申请公布号 |
US2014102909(A1) |
申请公布日期 |
2014.04.17 |
| 申请号 |
US201314108954 |
申请日期 |
2013.12.17 |
| 申请人 |
ENTHONE INC. |
发明人 |
PANECCASIO, JR. VINCENT;HURTUBISE RICHARD;LIN XUAN;FIGURA PAUL |
| 分类号 |
C25D3/38;C25D7/12;H01L21/288;H01L21/768 |
主分类号 |
C25D3/38 |
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