发明名称 INTERCONNECTS AND HEAT DISSIPATORS BASED ON NANOSTRUCTURES
摘要 The present invention provides for nanostnictures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices.
申请公布号 KR101386268(B1) 申请公布日期 2014.04.17
申请号 KR20137032883 申请日期 2006.08.28
申请人 发明人
分类号 B01J35/06;H01L23/42 主分类号 B01J35/06
代理机构 代理人
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