发明名称 BONDING MATERIAL AND BONDED OBJECT PRODUCED USING SAME
摘要 A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.
申请公布号 EP2719486(A1) 申请公布日期 2014.04.16
申请号 EP20110867177 申请日期 2011.06.10
申请人 DOWA ELECTRONICS MATERIALS CO., LTD. 发明人 KURITA SATORU;HINOTSU TAKASHI;SASAKI SHINYA
分类号 B22F9/00;B22F1/00;B22F1/02;H01B1/00;H01B1/22;H01L21/52;H05K3/32 主分类号 B22F9/00
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