| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of performing defect detection even when design data can not be obtained since importance of a defect can be determined by prior art while taking relative relation with a formation such as wiring on a wafer into consideration by using design data, but the determination can not be made without the design data. SOLUTION: With respect to a semiconductor device, the relative position associated with the formation on the semiconductor device is detected by acquiring an image of a top of the actual wafer instead of the design data for manufacture, so that the importance of the detect can be determined. COPYRIGHT: (C)2011,JPO&INPIT |
