发明名称 |
Integrated circuit packaging system with stack device |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; applying a molded under-fill on the base substrate; forming a substrate contact extender through the molded under-fill and in direct contact with the base substrate; mounting a stack device over the molded under-fill; attaching a coupling connector from the substrate contact extender to the stack device; and forming a base encapsulation on the stack device, the substrate contact extender, and encapsulating the coupling connector. |
申请公布号 |
US8698297(B2) |
申请公布日期 |
2014.04.15 |
申请号 |
US201113243699 |
申请日期 |
2011.09.23 |
申请人 |
BAE JOHYUN;YOON IN SANG;CHOI DAESIK;STATS CHIPPAC LTD. |
发明人 |
BAE JOHYUN;YOON IN SANG;CHOI DAESIK |
分类号 |
H01L23/02;H01L23/08;H01L23/52;H01L29/40 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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