发明名称 METHOD OF MOUNTING ELECTRONIC COMPONENTS
摘要 PROBLEM TO BE SOLVED: To provide a method of mounting electronic components whereby it is possible to prevent electronic components mounted on a circuit board with adhesives from turning over, etc., to effectively avoid causing troubles due to their turnover, etc. SOLUTION: In a coating step, conductive adhesives 6 are coated on conductor lands 2. In a heating step, a circuit board 1 is mounted on a hot plate 7 to heat the adhesives 6 at 50 deg.C for 10 min. In a mounting step, the lead terminals 5 of an Al electrolytic capacitor 3 are laid on the conductive adhesives 6, this raising the adhering force of the conductive adhesives 6 owing to the heating step to increase the mechanical connection strength of the lead terminals 5 to the conductor lands 2. This, even for a high-gravity-center electronic component such as Al electrolytic capacitors 3, etc., makes it possible to avoid turning the Al electrolytic capacitors 3 over.
申请公布号 JP2000022310(A) 申请公布日期 2000.01.21
申请号 JP19980190454 申请日期 1998.07.06
申请人 DENSO CORP 发明人 OTANI YUJI
分类号 C09J5/06;H05K3/32;(IPC1-7):H05K3/32 主分类号 C09J5/06
代理机构 代理人
主权项
地址