发明名称 |
Packaging substrate and fabrication method thereof |
摘要 |
A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging. |
申请公布号 |
US8698008(B2) |
申请公布日期 |
2014.04.15 |
申请号 |
US201113323205 |
申请日期 |
2011.12.12 |
申请人 |
YEN LEE-SHENG;WANG DOAU-TZU;ADVANCE MATERIALS CORPORATION |
发明人 |
YEN LEE-SHENG;WANG DOAU-TZU |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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